Malcom PCU-02V Spiral Pump Solder Paste Viscometer (Made in Japan):
- Technical Specifications: Measurement method coaxial double cylinder with inner spiral pumping screw rotor, measurement range 5 to 800 Pa·s (5,000 to 800,000 cP), rotational shear rate speeds: 0.6 / 1.2 / 3.0 / 6.0 / 12.0 / 30.0 RPM, built-in thermal sensor for real-time fluid temperature monitoring (10°C to 40°C), automatic Thixotropy Index (TI) computation, complies with JIS Z 3284 and ASTM standards for solder paste rheology, digital LED display, RS-232C PC communication output, Product of Malcom Co., Ltd. Japan.
- Patented Spiral Pump Measurement Architecture: Inner spiral screw continuously pumps solder paste upward through the measurement gap, eliminating slippage and paste separation artifacts.
- Complete Thixotropic Rheology Profiling: Measures viscosity across multiple shear rates (RPM) to accurately calculate the Thixotropy Index critical for SMT stencil printing quality.
- SMT Stencil Printing Quality Assurance: Detects solder paste aging, solvent evaporation, and poor viscosity before PCB printing to eliminate solder bridging and cold joints.
- Real-Time Temperature Compensation: Simultaneously measures fluid temperature to ensure highly reproducible viscosity data under varying cleanroom climates.
- Direct PC Data Logging & Quality Traceability: RS-232C port exports shear curves and viscosity datasets directly to QA statistical software.
- Applications: SMT electronics assembly PCB stencil printing QA, solder paste chemical R&D, conductive silver paste formulation, and thick-film hybrid IC manufacturing.
